A multilayered laminate, substructures and associated methods of fabrication are presented. The multilayered laminate includes in sequential order: (a) a first intermediate layer having microvias and conductive lands; (b) a plurality of signal/power plane substructures, wherein a dielectric material...http://www.google.es/patents/US20020108780?utm_source=gb-gplus-sharePatente US20020108780 - Multilayered laminate
Número de solicitud: 10/121,821 Número de publicación: US 2002/0108780 A1 Fecha de presentación: 11 Abr 2002 Patente emitida: US6518516 ( Fecha de emisión 11 Feb 2003)
