Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality of device contacts, and a conductive structure electrically connected to the contacts. The conductive structure...http://www.google.es/patents/US20050046000?utm_source=gb-gplus-sharePatente US20050046000 - Invertible microfeature device packages and associated methods
Invertible microfeature device packages and associated methods
Número de solicitud: 10/651,913 Número de publicación: US 2005/0046000 A1 Fecha de presentación: 29 Ago 2003 Patente emitida: US7368810 ( Fecha de emisión 6 May 2008)
