Low temperature processed back side redistribution lines (RDLs) are disclosed. Low temperature processed back side RDLs may be electrically connected to the active surface devices of a semiconductor substrate using through wafer interconnects (TWIs). The TWIs may be formed prior to forming the RDLs,...http://www.google.es/patents/US7994547?utm_source=gb-gplus-sharePatente US7994547 - Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects
Semiconductor devices and assemblies including back side redistribution ...
