A packaging method involves attaching a first chip to a stable base, forming contact pads at locations on the stable base, applying a medium onto the stable base such that it electrically insulates sides of the first chip, forming electrical paths on the medium, attaching a second chip to the first chip...http://www.google.es/patents/US7960210?utm_source=gb-gplus-sharePatente US7960210 - Ultra-thin chip packaging
