A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer; etching the metal layer to form patterns of leads; etching recesses in the substrate to cantilever the leads...http://www.google.es/patents/US7043831?utm_source=gb-gplus-sharePatente US7043831 - Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate
Method for fabricating a test interconnect for bumped semiconductor ...
