In the construction of electronic devices with one or more flip chips and, in some cases, one or more leadless components, mounted on a substrate, the interconnections are made with conductive adhesive or solder paste deposited using specialized stencils or masks, including suitable snap-back stencils...http://www.google.es/patents/US6316289?utm_source=gb-gplus-sharePatente US6316289 - Method of forming fine-pitch interconnections employing a standoff mask
Method of forming fine-pitch interconnections employing a standoff mask
