An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead...http://www.google.es/patents/US5263242?utm_source=gb-gplus-sharePatente US5263242 - Method of making semiconductor package with segmented lead frame
Method of making semiconductor package with segmented lead frame
