A semiconductor device which has trenches for raising the reliability thereof and a method for manufacturing such device. An electrode pad, and a protective film and an interlayer film which comprise an opening on top of this electrode pad, are formed on a substrate. A rewiring pattern which is in contact...http://www.google.es/patents/US20030102551?utm_source=gb-gplus-sharePatente US20030102551 - Semiconductor device and method for manufacturing
Número de solicitud: 10/331,480 Número de publicación: US 2003/0102551 A1 Fecha de presentación: 31 Dic 2002 Patente emitida: US7586181 ( Fecha de emisión 8 Sep 2009)
