A semi-conductor device having a conductive lead with an exposed tip disposed within a first insulative material, which is in turn disposed between insulated first and second integrated circuit chips is disclosed. The first insulative material is etched to form a recess after which a second...http://www.google.es/patents/US5793103?utm_source=gb-gplus-sharePatente US5793103 - Insulated cube with exposed wire lead
