An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further...http://www.google.es/patents/US20050003606?utm_source=gb-gplus-sharePatente US20050003606 - Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
Method and system for fabrication of integrated tunable/switchable passive ...
Número de solicitud: 10/897,271 Número de publicación: US 2005/0003606 A1 Fecha de presentación: 21 Jul 2004 Patente emitida: US7368311 ( Fecha de emisión 6 May 2008)
