A die contacting substrate establishes ohmic contact with the die by means of raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement...http://www.google.es/patents/US6828812?utm_source=gb-gplus-sharePatente US6828812 - Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections
Test apparatus for testing semiconductor dice including substrate with ...
