A dual damascene structure is created in a dielectric layer, the structure contains a barrier layer while a cap layer may or may not be provided over the layer of dielectric for further protection of the dual damascene structure. The surface of the copper in the dual damascene structure is recessed,...http://www.google.es/patents/US6251786?utm_source=gb-gplus-sharePatente US6251786 - Method to create a copper dual damascene structure with less dishing and erosion
Method to create a copper dual damascene structure with less dishing and erosion
