In the manufacture of Printed Circuit (PC) boards, conductors are placed in a base layer of glass cloth. The conductors penetrate the thickness of the cloth and can be arranged to form a matrix or grid. The arrangement of cloth and conductors is then cured with resin with the wire lengths disposed within...http://www.google.es/patents/US5992012?utm_source=gb-gplus-sharePatente US5992012 - Method for making electrical interconnections between layers of an IC package
Method for making electrical interconnections between layers of an IC package
