A microcomputer module 21 and a memory module 31 are mounted on a mounting substrate 42 in such a manner that first outer leads 23 of the microcomputer module 21 and first outer leads 33 of the memory module 31 are connected together in an overlapped manner....http://www.google.es/patents/US5912808?utm_source=gb-gplus-sharePatente US5912808 - Semiconductor component
