A cap wafer (10) is used to package semiconductor devices on a device wafer (30). Successive etching processes form a plurality of partially etched cavities (27) extending from a front surface (11) of the cap wafer (10) into the cap wafer (10). The pattern of the partially etched cavities (27) is determined...http://www.google.es/patents/US5604160?utm_source=gb-gplus-sharePatente US5604160 - Method for packaging semiconductor devices
