A method is disclosed for attaching a bonding pad to the ohmic contact of a diode while reducing the complexity of the photolithography steps. The method includes the steps of forming a blanket passivation layer over the epitaxial layers and ohmic contacts of a diode, depositing a photoresist layer over...http://www.google.es/patents/US7432536?utm_source=gb-gplus-sharePatente US7432536 - LED with self aligned bond pad
