A high-performance "low-RC" multi-level interconnect technology has been conceived for advanced sub-0.5 .mu.m semiconductor technologies. The proposed structure and fabrication process has a number of significant characteristics: (i) compatible with various metal systems (Al, Cu, W, etc.), (ii) free-space...http://www.google.es/patents/US5372969?utm_source=gb-gplus-sharePatente US5372969 - Low-RC multi-level interconnect technology for high-performance integrated circuits
Low-RC multi-level interconnect technology for high-performance integrated ...
