A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first...http://www.google.es/patents/US7545029?utm_source=gb-gplus-sharePatente US7545029 - Stack microelectronic assemblies
