A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer....http://www.google.es/patents/US7042077?utm_source=gb-gplus-sharePatente US7042077 - Integrated circuit package with low modulus layer and capacitor/interposer
Integrated circuit package with low modulus layer and capacitor/interposer
