A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions...http://www.google.es/patents/US7252582?utm_source=gb-gplus-sharePatente US7252582 - Optimized grooving structure for a CMP polishing pad
Optimized grooving structure for a CMP polishing pad
