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United States Patent

Hasegawa et al.

[19]

US006078640A [ii] Patent Number: [45] Date of Patent:

6,078,640 Jun. 20, 2000

[54] X-RAY EXPOSURE APPARATUS

[75] Inventors: Takayuki Hasegawa; Takeshi

Miyachi, both of Utsunomiya, Japan

[73] Assignee: Canon Kabushiki Kaisha, Tokyo, Japan

[21] Appl. No.: 09/106,893

[22] Filed: Jun. 30, 1998

[30] Foreign Application Priority Data

Jul. 1, 1997 [JP] Japan 9-188958

Jan. 26, 1998 [JP] Japan 10-026337

[51] Int. C I. G21K 5/00

[52] U.S. CI 378/34; 250/492.2

[58] Field of Search 378/34; 250/492.2;

359/359, 366

[56] References Cited

U.S. PATENT DOCUMENTS

5,329,126 7/1994 Amemiya et al 378/34

Primary Examiner—Craig E. Church

Attorney, Agent, or Firm—Fitzpatrick, Cella, Harper &

Scinto

[57] ABSTRACT

An exposure method and apparatus for lithographically transferring a pattern of a mask onto a substrate to be exposed, wherein a detecting system detects a relative positional relation between the mask and the substrate with respect to at least a predetermined direction, a stage member changes the relative positional relation between the mask and the substrate, on the basis of the detection by the detecting system, a magnification correcting mechanism corrects a transfer magnification of the mask pattern to the substrate, a control system for the stage member corrects one of a drive amount of the stage member and a detection result of the detecting system in accordance with a positional deviation of the mask pattern attributable to the correction operation of the magnification correcting mechanism.

12 Claims, 7 Drawing Sheets

[graphic]
[graphic]
[graphic][merged small]

HOLD WAFER BY WAFER CHUCK

SOI

GLOBAL AUTOALIGNMENT AND AUTOFOCUS
MEASUREMENT FOR WAFER EXPOSURE
MAGNIFICATION MEASUREMENT

S02

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