Anodized metal substrate module

US00805878lB2

(12) UIllt€d States Patent (10) Patent No.: US 8,058,781 B2 Lee et al. (45) Date of Patent: Nov. 15, 2011 (54) AN()])IZE]) METAL SUBSTRATE MODULE 2001/0030866 A1 * 10/2001 Hochstein ................... .. 362/294 2002/000l 177 Al l/2002 Petitbon _ . _ 2005/0068776 A1 3/2005 Ge (75) Inventors Youlllg Kl Lees Seoul (KR): seog Moon 2005/0116235 A1* 6/2005 Schultz et a1‘ ““““““““ H 257/79 @%%w$M%W@@Wm zmmmmm*omsmm ......... . Hmw Gyunggi-Do (KR); Sang Hyun Shin, 2007/0080360 A1 * 4/2007 Mirsky et al. ................. .. 257/99 GYungg1'D° (KR) FOREIGN PATENT DOCUMENTS (73) Assignees: Samsung Electro-Mechanics Co., Ltd., A Gyunggi-Do (KR); samsung LED C0-1 JP 2000-353826 12/2000 Ltd., Gyungg1-Do (KR) JP 2003-57461 2/2003 JP 2004-24l4l6 8/2004 ( * ) Notice: Subject to any disclaimer, the term of this OTHER PUBLICATIONS patent is extended or adjusted under 35 U_S_C_ 154(1)) by 213 days_ Korean Office Action, With English translation, issued in Korean Patent Application No. l0-2006-0025010, mailed Apr. 25, 2007. (21) App1_ NO_; 11 /723,059 Chinese Office Action, W/ English translation thereof, issued in Chinese Patent Application No. CN2007l00875234 dated May 8, 2009. - _ Japanese Office Action issued in Japanese Patent Application No. JP (22) Ffled' Alan 16’2007 2007457887,dmedJul28,2009 _ _ _ Chinese Office Action, W/ English translation thereof, issued in Chi(65) PYIOF Pllbllcatloll Data nese PatentApplication No. CN 2007100875234 dated Dec. 4, 2009. Japanese Office Action, W/ English translation thereof, issued in Us 2007/0217221 A1 SeP' 20’ 2007 Japanese Patent Application No. JP 2007-067887 mailed Mar. 30, 2010. (30) Foreign Application Priority Data (Continued) Mar. 17,2006 (KR) ...................... .. 10-2006-0025010 Primary Examiner * Toan Ton (51) Int. Cl. Assistant Examiner * Britt Hanley H01K 1/02 (2006.01) (74) Attorney, Agent, or Firm * McDermott Will & Emery F21 V 7/04 (2006.01) LLP (52) U.S. Cl. ........................................ .. 313/46; 362/612 (58) Field of Classification Search ................. .. 362/612 (57) ABSTRACT See application file for complete search history. An anodized metal substrate module superior in heat radiation properties and reduced in manufacturing costs. A metal (56) References Cited plate is provided. An anodized film is formed on the metal

U.S. PATENT DOCUMENTS

7,268,014 B2 * 9/2007 Lee et al. .................... .. 438/106 7,497,596 B2* 3/2009 Ge .............................. .. 362/294 1 06 107

OTHER PUBLICATIONS Japanese Decision of Rejection, with English translation, issued in

_ _ _ _ _ _ Japanese Patent Application No. 2007-067887, dated Jan. 4, 2011. Japanese Decrsron to Declrne Amendment, Wrth Englrsh translatron,

issued in Japanese Patent Application No. 2007-067887, dated Jan. 4, * cited by examiner 201 l .