Heat treating assembly and method

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(12) United States Patent

Lineton et al.

(io) Patent No.: (45) Date of Patent:

US 7,259,351 B2 Aug. 21, 2007

(54) HEAT TREATING ASSEMBLY AND METHOD

(75) Inventors: Warran Boyd Lineton, Ann Arbor, MI (US); Christopher Bagnall,

Greensburg, PA (US)

(73) Assignee: Federal-Mogul World Wide, Inc.,

Southfield, MI (US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 10/935,546

(22) Filed: Sep. 7, 2004

(65) Prior Publication Data

US 2006/0049157 Al Mar. 9, 2006

Int. CI.

B23K 26/00 (2006.01)

U.S. CI 219/121.6; 219/121.68

Field of Classification Search 219/121.6,

219/121.85,121.68; 228/46; 118/620; 427/457;

148/525, 565 See application file for complete search history.

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The subject invention provides a heat treating assembly. The heat treating assembly comprises a laser, a substrate, and a tool. The laser emits laser energy directed toward the substrate and the tool. The substrate absorbs the laser energy and produces heat energy within the substrate that alters the substrate. The tool is disposed in removable contact with the substrate to conduct the heat energy away from the substrate to limit the altering of the substrate. Preferably, the tool has a thermal conductivity greater than that of the substrate and is more preferably a copper material, a gold material, a silver material, or an aluminum material.

14 Claims, 3 Drawing Sheets