MODULAR PATCH PANEL
 Inventors: Steven R. Hilbert, Elgin; Michael J.
McAndrews, Chicago, both of 111.
 Assignee: Reliance Comm/Tec Corporation, Chicago, 111.
 Appl. No.: 735,426
 Filed: Jul. 25, 1991
 Int. CI.' H01R 13/627
 U.S. CI 439/532; 361/396;
 Field of Search 439/532, 552, 557, 716,
439/715; 361/396, 417, 419, 420, 426. 427, 429;
379/325, 327, 328
 References Cited
U.S. PATENT DOCUMENTS
3.535.463 10/1970 Trucco 379/327
4,717,358 1/1988 Chaundy 439/557
4,811.169 3/1989 Deluca et al 361/429
Reliance COMM/TEC, RMOD-DSX brochure. Reliance COMM/TEC, "Network Bay Frames For
A digital signal cross-connect having a relatively high digital signal transmission rate for use with telecommunications transmission networks mountable in an existing network bay frame designed for mounting digital signal cross-connects having substantially lower signal transmission rates comprises a housing having at least a top panel and a bottom panel. A mounting tang is disposed on the top panel, and a mounting notch is located on the bottom panel. The mounting notch is capable of accepting rail tangs of a shelf which in turn mounts to on the network bay frame. The cross-connect is capable of pivotal movement about the rail tangs when the rail tangs are disposed in the mounting notch, and the mounting tang is capable of releasably engaging a rack rail on the shelf.
15 Claims, 5 Drawing Sheets