Multi-component integrated circuit contacts

(54) MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS

(75) Inventors: William M. Hiatt, Eagle, ID (US);

Warren M. Farnworth, Nampa, ID
(US)

(73) Assignee: Micron Technology, Inc., Boise, ID
(US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl.No.: 11/535,414

(22) Filed: Sep. 26, 2006

(65) Prior Publication Data

US 2007/0018321 Al Jan. 25, 2007

Related U.S. Application Data

(63) Continuation of application No. 10/231,877, filed on Aug. 29, 2002, now Pat. No. 7,115,998.

(51) Int. CI.

H01L 23/48 (2006.01)

(52) U.S. CI 257/780; 257/E23.021;

257/E21.508; 257/773; 257/775; 257/737; 257/781; 257/692; 257/459; 257/738; 257/779

(58) Field of Classification Search 257/737,

257/781, E23.021, E21.508, 773, 780, 775, 257/778, 779, 692, 459 See application file for complete search history.

(56) References Cited

U.S. PATENT DOCUMENTS

An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body fixed in a layer of an integrated circuit structure and extends outwardly from the integrated circuit structure. The second material is adapted to form a mechanical connection to a further electrical device. The second material (e.g., solder), is held by the first member to the integrated circuit structure. The first member increases the strength of the connection and assists in controlling the collapse of second member to form the mechanical connection to another circuit. The connection is formed by coating the integrated circuit structure with a patterned resist and etching the layer beneath the resist. A first member material (e.g., metal) is deposited. The resist is removed. The collapsible material is fixed to the first member.

29 Claims, 14 Drawing Sheets