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US006717060B2
(12) United States Patent ao) Patent No.: us 6,717,060 B2
Kragl et al. (45) Date of Patent: Apr. 6,2004
(54) CIRCUIT BOARD CONSISTING OF AT
LEAST TWO INDIVIDUAL CIRCUIT BOARD
LAYERS MADE OF PLASTIC
(75) Inventors: Hans Kragl, Diekholzen (DE); Rolf
Hohmann, Bad Salzdetfurth (DE)
(73) Assignee: Harting Elektro-optische Bauteile GmbH & Co. KG (DE)
( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/854,779
(22) Filed: May 14, 2001
(65) Prior Publication Data
US 2002/0011349 Al Jan. 31, 2002 (30) Foreign Application Priority Data
May 15, 2000 (DE) 100 23 736
(51) Int. C I. H05K 1/03
(52) U.S. CI 174/255; 174/254; 174/260
(58) Field of Search 174/254, 260,
174/255; 361/747, 750, 751, 767, 769,
789, 816; 439/77, 67
A circuit board (5) is described, consisting ol at least two individual circuit board layers (10) made ol plastics and produced by formation technique, which each have first and second lunctional sides and at least one microstructured positioning formation (16) on each ol the first and second lunctional sides and at least one microstructured conductor trench (12) on one ol the lunctional sides, the conductor trench (12) being provided with a metallization (18). This allows a low expenditure production ol circuit boards having a high packing density.
24 Claims, 7 Drawing Sheets
