BGA package having substrate with patterned solder mask defining open die ...

(54) BGA PACKAGE HAVING SUBSTRATE WITH PATTERNED SOLDER MASK DEFINING OPEN DIE ATTACH AREA

(75) Inventors: Tongbi Jiang, Boise, ID (US); Edward Schrock, Boise, ID (US)

(73) Assignee: Micron Technology, Inc., Boise, ID (US)

( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 09/258,961

(22) Filed: Mar. 1, 1999

(65) Prior Publication Data

US 2001/0013642 Al Aug. 16, 2001

Related U.S. Application Data

(62) Division ol application No. 09/191,215, filed on Nov. 12, 1998, now Pat. No. 6,048,755.

(51) Int. CI.7 H01L 23/48; H01L 23/52;

H01L 29/40

(52) U.S. CI 257/783; 257/780; 257/782;

257/784; 257/787; 257/702; 257/713

(58) Field of Search 257/783-784,

257/782, 780, 738, 702, 787, 713, 737

(56) References Cited

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* cited by examiner

Primary Examiner—Nitin Parenkh

(74) Attorney, Agent, or Firm—Stephen A. Gratton

A BGA package and a method of fabricating the BGA package is provided. The package includes a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface with a die attach area thereon. A first solder mask is formed on the first surface with via openings to ball bonding pads on the conductors. A second solder mask is formed on the second surface with an opening on the die attach area. The opening in the second solder mask permits a die to be placed through the opening and adhesively bonded directly to the substrate. The die can then be wire bonded to the conductors and encapsulated in an encapsulating resin. In addition solder balls can be placed in the via openings and bonded to the ball bonding pads.

7 Claims, 6 Drawing Sheets