A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding...http://www.google.es/patents/US7602070?utm_source=gb-gplus-sharePatente US7602070 - Room temperature metal direct bonding
