In a vacuum chamber wafer treating apparatus, a wafer is heated or cooled by introducing a gas at a pressure of approximately 100 to 1000 microns in a region between the wafer and a heating element or heat sink. The gas conducts thermal energy between the wafer and heating element or heat sink....http://www.google.es/patents/US4909314?utm_source=gb-gplus-sharePatente US4909314 - Apparatus for thermal treatment of a wafer in an evacuated environment
Apparatus for thermal treatment of a wafer in an evacuated environment
