Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of...http://www.google.es/patents/US7037751?utm_source=gb-gplus-sharePatente US7037751 - Fabrication of stacked microelectronic devices
