A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically connects the routing line and the pad, an encapsulant and an insulative base. The routing line contacts the filler...http://www.google.es/patents/US7453140?utm_source=gb-gplus-sharePatente US7453140 - Semiconductor chip assembly with laterally aligned filler and insulative base
Semiconductor chip assembly with laterally aligned filler and insulative base
