Used ESEC 2100 HS #293645937 for sale

ESEC 2100 HS is a fully automated, cost effective die attacher designed for use in semiconductor packaging applications. The equipment features high speed dual head attachment, pre-defined position and carrier consistency, and reliable packaging. It has a broad range of geometry and die sizes, enabling optimized performance and efficient placement of die on a variety of packages. The system utilizes a unique "Snappy" assembly method. Two thermocompression heads with interchangeable tips are mounted on a linear positioning device. The die is positioned on the package substrate in one of the selected positions and is then heated and compressed with the tip. The heated and compressed tip applies pressure to the die which is melted into the substrate, creating an interconnection. This thermocompressive technique ensures consistent attachment with low yield losses. The unit also features an expandable, multi-die placement library. All parameters such as die size, thermal head temperature and top surface temperature are pre-programmed and stored in the machine. This library allows users to recall and modify existing programs for a wide range of die sizes. A secure, user defined password is required for configuration changes to prevent unauthorized access. The tool is designed for easy operation with a user friendly graphical display. The intuitive graphical user interface allows operators to easily enter and modify parameters, check progress and troubleshoot malfunctions. All of the asset parameters can be set easily, allowing for changes to the die size or attachment parameters. The model also optimizes production efficiencies by providing operators with visibility into total die control, counting and placement processing data. Finally, 2100 HS is equipped with a number of safety features to protect both operators and substrate materials during the die attacher process. An emergency stop button is provided to quickly halt operation, while a protective barrier ensures operator safety during operation. In addition, the equipment includes an automatic substrate ejection feature which prevents substrate damage due to overheating or accelerated heating. ESEC 2100 HS is an automated machine designed to provide reliable die attachment with efficient process parameters and minimal waste. It offers high speed, consistent placement and a library of pre-defined parameters for a wide range of die sizes and geometries. The intuitive user interface makes the system simple to operate, while a number of additional features, such as protection against waste material or substrate damage, provide an additional layer of safety. Ultimately, 2100 HS is an efficient and reliable solution for die attachment.